发明名称 PRINTED CIRCUIT BOARD WITH ELECTRONIC COMPONENT EMBEDDED THEREIN AND MANUFACTURING METHOD THEREFOR
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a printed circuit board with an electronic component embedded therein that can be manufactured by a simple process without using a tape, and a manufacturing method therefor. <P>SOLUTION: The printed circuit board includes: a core substrate including a support metal layer (106) formed on a surface of an insulating resin layer (102) protrusively having a cavity and an internal circuit layer formed on both surfaces of the insulating resin layer (102); an electronic component (109) which is embedded in the cavity while being supported on the support metal layer (106); and a buildup layer (115) including an insulating layer (112) and external layer circuit layers (114) formed on both surfaces of the core substrate. The support of the electronic component (109) by the support metal layer (106) is effective in not only increasing support and heat dissipation capability but also in reducing manufacturing cost and simplifying the manufacturing process. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2009295949(A) 申请公布日期 2009.12.17
申请号 JP20080212981 申请日期 2008.08.21
申请人 SAMSUNG ELECTRO MECH CO LTD 发明人 PARK HWA SUN;CHUNG YUL KYO;LEE JIN WON;JEONG JIN SOO
分类号 H05K3/46;H01L21/60 主分类号 H05K3/46
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