| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a conductive bump which is easily deformed with low pressurizing force and easily passes through the adhesive resin layer of an NCF or the like, and to provide a method for forming the same, an electronic component mounting structure using the same. Ž<P>SOLUTION: The conductive bump 11 is formed on the electrode 13 of an electronic component 12, the conductive bump 11 is composed of a first bump 14 including a first resin and a first conductive filler, and a second bump 15 including a second resin and a second conductive filler provided on the first bump 14. The conductive bump 11 to be easily deformed with the low pressurizing force is achieved. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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