| 摘要 |
Provided is a heat curable adhesive that can strongly bond a base material formed of a crystalline polyester resin, can freely regulate the thickness of an adhesive layer, has excellent chemical resistance, and, at the same time, has excellent storage stability. Furthermore, provided is a resin laminated-type IC card, in which a liquid heat curable adhesive of which use has been difficult in the past can be used, and the liquid heat curable adhesive can be coated with a good accuracy by a printing method without the need to perform molding into a hot-melt sheet to bond a base material formed of a crystalline polyester resin. Accordingly, the resin laminated-type IC card can have a high degree of freedom in design of the thickness of an IC card. The heat curable adhesive comprises (a) a hydroxyl group-containing non-crystalline polyester resin, (b) a resin containing a carboxylic acid anhydride, and (c) a solvent for dissolving (a) the hydroxyl group-containing non-crystalline polyester resin. |
