| 摘要 |
PURPOSE: A chip having side protrusion terminal and a package using a chip are provided to design a free package by reducing the total thickness of a package having a chip and a chip having a lateral protruded terminal. CONSTITUTION: In a device, a chip(100) having protrusion on the side of it includes a chip body(10) and a terminal(20) protruded from the side of it. The chip body has a thin rectangular shape consisting of one top(10a), four sides(10b), and one bottom(10c). An active surface including various types of a conductive pattern is formed on the top of the chip body. The lateral protrusion is electrically connected to the active surface. The lateral protruded terminal has a shape projected at least one side of the chip body. A ground plane(30) for improving grounding performance is installed at the lower-part of the chip body.
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