| 摘要 |
PROBLEM TO BE SOLVED: To coat a required part on one surface of a substrate with a primer without being limited by an electronic component mounted thereon in a substrate having one surface for mounting the electronic component which may be sealed by molding resin. SOLUTION: In a substrate 50 having one surface 50a mounted with electronic components 20 and 30, and in which the one surface 50a may be sealed by molding resin 70, a through-hole 1 is formed to penetrate the surface 50a from the other surface 50b, a groove 2 is formed at a part of the surface 50a which is sealed by molding resin 70, the groove 2 extends to the opening of the through-hole 1 at the surface 50a, and when a primer 90 for securing adhesion between the molding resin 70 and the substrate 50 is supplied to the through-hole 1 from the other surface 50b side, the primer 90 is moved to the one surface 50a via the through-hole 1 and spread into the groove 2 by surface tension. COPYRIGHT: (C)2010,JPO&INPIT |
