发明名称 SUSPENSION METHOD FOR COMPLIANT THERMAL CONTACT OF ELECTRONICS MODULES
摘要 A communication module is provided. In one embodiment, the communication module includes at least one transceiver, a filter communicatively coupled with the at least one transceiver, a power amplifier communicatively coupled to the at least one transceiver and the filter, a primary module chassis configured to hold the at least one transceiver, the filter, and the power amplifier, and a filter suspension frame assembly attached to the primary module chassis. The filter suspension frame assembly is configured to float the at least one transceiver in relation to the primary module chassis.
申请公布号 US2009311974(A1) 申请公布日期 2009.12.17
申请号 US20090470648 申请日期 2009.05.22
申请人 ADC TELECOMMUNICATIONS, INC. 发明人 NELSON MICHAEL J.;WAYMAN MICHAEL J.;THOMPSON KEVIN
分类号 H04B1/38;F28F7/00 主分类号 H04B1/38
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