| 摘要 |
<p>Separating sections of a separating device, which is used to separate sealed substrates to manufacture electronic components, can be assembled, changed, added, or removed quickly according to specifications requested by a user. An electronic component separating device (S1) is equipped with a receiving section (A), separating sections (B1, B2), and a delivery section (C). The separating sections (B1, B2) each have a rotary blade (7) as a cutting mechanism, and each can be attached to or detached from another separating section (B1, B2), or a receiving section (A) or a delivery section (C), which are the other components, and may be assembled, changed, added, or removed selectively to meet specifications requested by a user. The cutting mechanism of the separating sections (B1, B2) is not limited to the rotary blades (7), and a water jet, a laser beam, a wire saw, or a band saw could be used. The cutting mechanisms of the separating sections (B1, B2) may be different. For example, the cutting mechanism of the separating section B1 may utilize a water jet, and the cutting mechanism of the separating section B2 may utilize a rotary blade (7).</p> |
