发明名称 CURABLE COMPOSITIONS
摘要 <p>Fast-setting curable compositions which can satisfactorily bond adherends even when a gap is formed between the adherends as far as the size of the gap is about 100µm or below. A curable composition comprising at least one organic peroxide, a cure accelerator which can react with the peroxide to accelerate the polymerization of monomers, a monofunctional (meth)acrylate, and a polyfunctional (meth)acrylate, characterized in that the peroxide is enveloped in microcapsules, preferably, a curable composition as described above, characterized in that the monofunctional (meth)acrylate contains both a (meth)acrylate bearing a carboxyl group and a (meth)acrylate bearing an alicyclic hydrocarbon.</p>
申请公布号 WO2009150727(A1) 申请公布日期 2009.12.17
申请号 WO2008JP60711 申请日期 2008.06.11
申请人 DENKI KAGAKU KOGYO KABUSHIKI KAISHA;KOBAYASHI, KEITA;YODA, KIMIHIKO;WATANABE, JUN 发明人 KOBAYASHI, KEITA;YODA, KIMIHIKO;WATANABE, JUN
分类号 C08F20/04;C08F2/32;C09J11/06;C09J133/08 主分类号 C08F20/04
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