PRINTED CIRCUIT BOARD AND A FABRICATING METHOD OF THE SAME

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to reduce resistivity by connecting a bump with a carbon nano tube or carbon nano fiber to a circuit layer. CONSTITUTION: A printed circuit board includes an insulation layer(104), a first circuit layer(101a), a second circuit layer(105a), a bump(102), and a buildup layer. The first and second circuit layers are formed in both sides of the insulation layer. The bump electrically connects the first circuit layer and the second circuit layer. The bump is made of plastic paste including a carbon nano tube. The bump includes a carbon nano tube or carbon nano fiber, a metal particle, and an additive. The buildup layer is formed on the first circuit layer and the second circuit layer. The buildup layer includes the buildup insulation layer and the buildup circuit layer.