| 摘要 |
PURPOSE: Single wafer type cleaning device and method are provided to shorten wafer cleaning time by using a cleaning unit for simultaneously spraying cleaning solution onto both sides of a substrate. CONSTITUTION: A cleaning chamber(10) prevents flying of cleaning solution sprayed onto a substrate. The substrate is inserted through one opened surface of the cleaning chamber. A first opening(11) and a second opening(12) are formed at a lateral surface of the cleaning chamber. A supporting unit is moved along the first opening. A cleaning unit is moved along the first and the second openings. The supporting unit supports the substrate which is located in an upright state within the cleaning chamber. The supporting unit includes a supporting plate(21) and a fixing member(22). The cleaning unit cleans both sides of the substrate at the same time. The cleaning unit includes a first and a second spraying nozzles(31,32). A recovery path is formed at an inner peripheral surface of the cleaning chamber in order to cover an outer peripheral part of the substrate. An exhaust unit compulsorily discharges the cleaning solution which remains in the cleaning chamber. The exhaust unit includes an air pressure generating unit(51) and an air pressure spraying unit(52).
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