| 发明名称 |
Solid-state imaging apparatus |
| 摘要 |
At least a solid-state imaging device (3) and one or a plurality of bare ICs (6) that are disposed on the back face side of the solid-state imaging apparatus and serve as peripheral circuits are provided. A circuit board (1a) is interposed between the solid-state imaging device and the bare ICs. |
| 申请公布号 |
EP1715525(B1) |
申请公布日期 |
2009.12.16 |
| 申请号 |
EP20060014847 |
申请日期 |
1997.05.14 |
| 申请人 |
SONY CORPORATION |
发明人 |
TAKAGI, YUICHI;KANAZAWA, MASAYOSHI;UEDA, KAZUHIKO;TSUCHIMOCHI, MAKOTO;IKEDA, SHIGEO |
| 分类号 |
H01L25/16;H01L31/0203;H01L31/0216;H01L31/0232;H05K1/00;H05K1/03;H05K1/14 |
主分类号 |
H01L25/16 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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