SEMICONDUCTOR INSPECTING APPARATUS AND SEMICONDUCTOR INSPECTING METHOD

摘要

A semiconductor inspecting apparatus is provided with an inspecting circuit which inspects a semiconductor element to be inspected, and a plurality of wirings connected to the inspecting circuit.  Each of the inspecting circuits is provided with a wireless element arranged at a position facing the semiconductor element to be inspected, and when a specified signal is inputted through one of the wirings, an inspection signal required for inspecting the semiconductor element is wirelessly transmitted from the wireless element, and a response signal to the inspection signal is received from the semiconductor element through the wireless element.  A multilayer wiring layer including the wirings is formed on a surface whereupon the wireless element is formed.