发明名称 THERMAL TRANSFER DEVICE
摘要 <p>A thermal transfer device includes a thermally conductive wall (33), a cooling plate (31), and a circuit board (35) fixedly connected with the cooling plate (31); wherein, the thermally conductive wall (33) is provided with a bevel slide way chute (32), and the cooling plate (31) is provided with a contact end (34), which is inserted along the bevel slide way chute (32) to fix the cooling plate (31) that is fixed with the circuit board (35). In present invention, the contact end (34) of the cooling plate (31) cooperates with the bevel slide way chute (32) on the thermally conductive wall (33), it reduces the thermal resistance between the heating device on the circuit board (35) connected with the cooling plate (31) and the slide way (28), and provides good heat dissipation effect. And the thermal transfer device makes it convenient to plug/unplug and to fix the cooling plate (31) in the bevel slide way chute (32) of the thermally conductive wall (33). The device is simple in structure, and is easy to use, and does not need additional locking devices, so it can reduce the cost.</p>
申请公布号 WO2009149640(A1) 申请公布日期 2009.12.17
申请号 WO2009CN71984 申请日期 2009.05.26
申请人 HUAWEI TECHNOLOGIES CO., LTD.;AO, FENG;LI, ZHIJIAN;LI, YAO 发明人 AO, FENG;LI, ZHIJIAN;LI, YAO
分类号 H05K7/20 主分类号 H05K7/20
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