| 摘要 |
PURPOSE:To prevent the breaking of a ceramic member as the base of the title substrate and a semiconductor mounted by joining Cu or Cu alloy members joined with a restraining member of Mo, W or an alloy thereof having a specified thickness to the ceramic member. CONSTITUTION:When a Cu or Cu alloy member 2 is joined to a ceramic member 1 such as an alumina member to form a composite substrate, Cu or Cu alloy members 2A, 2B joined with a restraining member 3 of Mo, W or an alloy thereof having a thickness corresponding to 1/20-1/3 of the thickness of the member 2 are joined to the ceramic member 1. Heat conductivity and electrical conductivity are ensured for the substrate and stress produced in the ceramic base and a semiconductor mounted is relieved.
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