发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR PRODUCING PATTERNED HARDENED FILM WITH USE THEREOF AND ELECTRONIC PART |
摘要 |
<p>A photosensitive resin composition that gives a hardened film whose properties are by no means inferior to those of film hardened at high temperature; a process for producing a patterned hardened film with the use of the resin composition; and electronic parts. The photosensitive resin composition comprises (a) polybenzoxazole precursor having any of repeating units of the general formula:[chemical formula 1](I) (wherein U and V are bivalent organic groups, provided that at least one of U and V is a group containing a C-Caliphatic chain structure), (b) photosensitive agent, (c) solvent and (d) crosslinking agent capable of crosslinking or polymerization when heated.</p> |
申请公布号 |
KR20090129403(A) |
申请公布日期 |
2009.12.16 |
申请号 |
KR20097017117 |
申请日期 |
2008.03.06 |
申请人 |
HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. |
发明人 |
MINEGISHI TOMONORI;NOGITA RIKA;IWASHITA KENICHI |
分类号 |
G03F7/004;C08G73/10;C08G73/22;G03F7/023 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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