发明名称 |
FIRE-RETARDANT ADHESIVE RESIN COMPOSITION, AND ADHESIVE FILM USING THE SAME |
摘要 |
<p>Disclosed is a halogen- and phosphorus-free flame-retardant adhesive resin composition which can be used in heat contact bonding of adherends at or below 250°C and is excellent in heat resistance, solder heat resistance after moisture absorption, and processability. Also disclosed is an adhesive film produced from said composition. The flame-retardant adhesive resin composition comprises 65-98% by weight of a silicone unit-containing polyimide resin and 2-35% by weight of an epoxy resin having an acenaphthylene-substituted naphthalene skeleton. The adhesive film produced from the flame-retardant adhesive resin composition is suitable as an adhesive for a laminate for a multiplayer printed circuit board substrate, an adhesive for a hybrid circuit board substrate, and an adhesive for a coverlay film.</p> |
申请公布号 |
EP2133398(A1) |
申请公布日期 |
2009.12.16 |
申请号 |
EP20080721481 |
申请日期 |
2008.03.06 |
申请人 |
NIPPON STEEL CHEMICAL CO., LTD. |
发明人 |
MORI, AKIRA;TOKUHISA, KIWAMU;NAKAHARA, KAZUHIKO;KAJI, MASASHI |
分类号 |
C09J179/08;C08L63/00;C08L79/08;C09J7/00;C09J11/06;C09J163/00;C09J183/04;H05K3/38 |
主分类号 |
C09J179/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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