SUBSTRATE WITH ACTIVE DEVICE CHIP EMBEDDED THEREIN AND FABRICATING METHOD THEREOF

摘要

PURPOSE: An active device chip embedded substrate and a manufacturing method thereof are provided to prevent the damage to an active device chip in a water grinding process, a chip dicing process, and a chip mounting process by coating the first polymer on a wafer. CONSTITUTION: An electrode pad(110) is formed on an active device chip(100). The first polymer is coated on the active device chip to surround the electrode pad. The thermal expansion coefficient of the first polymer is equal to or less than the thermal expansion coefficient of the active device chip. The active device chip is adhered to the carrier. The second polymer(150) is laminated on the carrier to surround the active device chip and the first polymer. A first copper layer(160) is formed on the first polymer. A second copper layer(170) is formed under the second polymer and the active device chip. A first via exposes the electrode pad of the active device chip. The second via passes through the first and second copper layers and the second polymer. The conductive material is filled in the first via and the second via.