发明名称
摘要 A semiconductor device comprises a semiconductor layer including a plurality of paralleled linear straight sections extending in a first direction. The layer also includes a plurality of connecting sections each having a width in the first direction sufficient to form a wire-connectable contact therein and arranged to connect between adjacent ones of the straight sections in a second direction. The connecting sections have respective ends formed aligned with a first straight line parallel to the second direction.
申请公布号 JP4384199(B2) 申请公布日期 2009.12.16
申请号 JP20070098227 申请日期 2007.04.04
申请人 发明人
分类号 H01L21/3065;H01L21/768;H01L23/522 主分类号 H01L21/3065
代理机构 代理人
主权项
地址
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