发明名称 |
Biodegradable packaging for electronic components |
摘要 |
<p>The package (1) has two layers whose materials are completely biodegradable or compostable individually and/or in combination. One of the layers is formed as a carrier layer for retaining the other layer, which is formed as a nano adhesive layer (4) on the carrier layer. The nano adhesive layer is provided with adhesive sticking surface whose adhesive force is determined by components (7) to be retained. The nano adhesive layer has a thickness, which is smaller than a thickness of the carrier layer. The nano adhesive layer is attached at a common surface of the carrier layer. An independent claim is also included for a method for producing a composite package.</p> |
申请公布号 |
EP2133199(A1) |
申请公布日期 |
2009.12.16 |
申请号 |
EP20090006499 |
申请日期 |
2009.05.14 |
申请人 |
AMPHENOL-TUCHEL ELECTRONICS GMBH |
发明人 |
NITSCHE, AXEL;KORBER, FRANZ |
分类号 |
B32B9/02;B32B29/00;B65D65/40;B65D65/46 |
主分类号 |
B32B9/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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