| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an inexpensive package for light-emitting element in which light reflection efficiency can be enhanced, and at the same time has less migration, and to provide its manufacturing method. <P>SOLUTION: The package 10 for light emitting element having a plurality of conductor patterns formed of a plurality of layers of conductor film on the opposite major surfaces of a ceramic multilayer substrate 11, and a ring-like frame 12 for forming a recess 13 containing a light-emitting element on one major surface side is provided with a conductor pattern on one major surface side, a bonding pad 14 for bringing it into electrically continuous state with the light-emitting element by wire bonding or flip-chip interconnection, and a first electroplating coating 16, i.e. the conductor film on the top surface of a conductor pattern on the other major surface side, wherein a second electroplating coating 17 of different material from that of the first electroplating coating 16 is provided, at least on the inner circumferential side face of the frame 12. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
