| 摘要 |
PURPOSE: An electrolytic tin plating solution and an electrolytic tin plating method are provided to lower a coupling ratio and improve solder wetting properties by not using a complexing agent. CONSTITUTION: An electrolytic tin plating solution for chip parts comprises tin ion, acid, N, N-dipolyoxyalkylene-N-alkylamine, amine oxide or a mixture thereof, and an anti-adhesion agent. The Ph of the tin plating solution is 1 or less. The tin plating solution also includes a plating uniformity improver, one or more acrylic acids or acryl derivative, and antioxidant. The anti-adhesion agent is one or more compounds selected from the group consisting of aromatic aldehyde and aromatic ketone. |
