| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board and an electronic device wherein occurrence of an oxide film in the surface of a circuit pattern and a void in a through-hole is suppressed, and also to provide manufacturing methods of them. SOLUTION: The circuit pattern 2 is disposed on one side of a substrate 1 in a thickness direction thereof. The through-hole 30 formed in the substrate 1 with one end connected to the circuit pattern 2, is filled with a through electrode 3. The circuit pattern 2 and the through electrode 3 have areas AL1 and AL2, respectively, containing a noble metal component (Au component) and are connected to each other through the areas AL1 and AL2. COPYRIGHT: (C)2010,JPO&INPIT |
