LAMINATING SYSTEM FOR FILM

摘要

PURPOSE: A film bonding apparatus is provided to omit a bubble removal process by eliminating the bubble in the process of bonding a film on a base substrate, thereby reducing the manufacturing process. CONSTITUTION: A pair of bonding rollers(210a,210b) applies heat and pressure to a film to bond the film on a base substrate(100). Backup rollers(220a,220b) are linearly contacted with the bonding rollers. The backup rollers pressurize uniformly the bonding rollers. A plurality of sub rollers(230a,230b) is arranged along the longitudinal direction of the backup rollers. The sub rollers pressurize uniformly the backup rollers. Before the base substrate passes through the bonding rollers, a pre-heater preheats the base substrate.