发明名称 |
Plating apparatus |
摘要 |
A plating apparatus has a frame configured to be placed on a substrate so that a plating bath is formed by the frame and the substrate. The frame includes a conductive core and a seal member covering the conductive core. The plating apparatus also has a non-conductive porous member configured to be immersed in an electrolytic plating solution held in the plating bath, a counter electrode disposed on the non-conductive porous member so as to face the substrate with a predetermined distance from the substrate, and a feed contact configured to be brought into contact with a peripheral portion of the substrate outside of the frame. The plating apparatus includes a power source operable to apply a voltage between the counter electrode and the substrate and a potential adjuster operable to control a potential of the conductive core of the frame with respect to a potential of the substrate. |
申请公布号 |
US7632382(B2) |
申请公布日期 |
2009.12.15 |
申请号 |
US20050123176 |
申请日期 |
2005.05.06 |
申请人 |
EBARA CORPORATION;ROHM CO., LTD.;KABUSHIKI KAISHA TOSHIBA |
发明人 |
SAITO KOJI;SAMESHIMA KATSUMI;MIKATA YUUICHI |
分类号 |
C25D5/00;C25D17/00;C25D7/12;C25D17/06;C25D17/10;H01L21/288;H01L21/44;H01L21/768 |
主分类号 |
C25D5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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