| 摘要 |
Methods for the production of a board (11) with printed circuit (12) shielde d against interfering radiation and having electronic components (14) comprise the steps of positioning of the electronic components (14) on contact points (15) designed for them, and the application of a shield (20), comprising a preformed metallized plastic film (30) over the top of the electronic components (14) and in electrical contact with the earth (13) on the board (11) with printed circuit (12), and also fixing the electronic components (1 4) on the board (11) with printed circuit (12) by means of an electrically conducting fixing agent (16); and fixing of the shield (20) on the board (11 ) with printed circuit (12). |
