CONDUCTIVE PATTERN FILM AND ITS BONDING METHOD

摘要

PURPOSE: A conductive pattern film and a bonding method thereof are provided to reduce fabrication cost by using fabric and fiber having conductive patterns. CONSTITUTION: A conductive pattern film(100) includes a polymer film(110) and conductive penetration holes(120) formed at the polymer film. The conductive penetration holes are formed at the polymer film so as to be a predetermined pattern. The polymer film is formed of insulating material such as polystyrene or polyimide which is used for an ACF(anisotropic conductive film). The polymer performs a role of preventing a short circuit between the conductive penetration holes. A metal layer(130) contains nickel or copper and is formed in the vicinity of walls and entrances of the conductive penetration holes. The central parts of the conductive penetration holes are filled with solders. A solder bump(140) is formed at entrances of the conductive penetration holes.