发明名称 Semiconductor thin film using self-assembled monolayers and methods of production thereof
摘要 A semiconductor thin film using a self-assembled monolayer (SAM) and a method for producing the semiconductor thin film are provided. According to the semiconductor thin film, a uniform inorganic seed layer is formed by using the self-assembled monolayer so that the adhesion between an insulating layer and a semiconductor layer is enhanced and thus the surface tension is reduced, thereby allowing the semiconductor thin film to have high quality without defects.
申请公布号 US7633087(B2) 申请公布日期 2009.12.15
申请号 US20060417026 申请日期 2006.05.03
申请人 SAMSUNG CORNING PRECISION GLASS CO., LTD. 发明人 SHIN HYEON JIN;CHUNG YOUNG SU;JEONG HYUN DAM;HYUN SANG HEON;SEON JONG BAEK
分类号 H01L35/24;H01L51/00 主分类号 H01L35/24
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