发明名称 |
Semiconductor thin film using self-assembled monolayers and methods of production thereof |
摘要 |
A semiconductor thin film using a self-assembled monolayer (SAM) and a method for producing the semiconductor thin film are provided. According to the semiconductor thin film, a uniform inorganic seed layer is formed by using the self-assembled monolayer so that the adhesion between an insulating layer and a semiconductor layer is enhanced and thus the surface tension is reduced, thereby allowing the semiconductor thin film to have high quality without defects. |
申请公布号 |
US7633087(B2) |
申请公布日期 |
2009.12.15 |
申请号 |
US20060417026 |
申请日期 |
2006.05.03 |
申请人 |
SAMSUNG CORNING PRECISION GLASS CO., LTD. |
发明人 |
SHIN HYEON JIN;CHUNG YOUNG SU;JEONG HYUN DAM;HYUN SANG HEON;SEON JONG BAEK |
分类号 |
H01L35/24;H01L51/00 |
主分类号 |
H01L35/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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