发明名称 Circuits including a titanium substrate
摘要 A process is disclosed for manufacturing a thick-film circuit such as a hybrid circuit on a titanium or titanium-alloy substrate. The process includes firing a glassy dielectric layer upon at least one surface of the substrate. A thick-film circuit including a titanium or titanium-alloy substrate is also disclosed.
申请公布号 US7632537(B2) 申请公布日期 2009.12.15
申请号 US20030694888 申请日期 2003.10.29
申请人 HYBIRD ELECTRONICS AUSTRALIA PTY LTD. 发明人 BERRYMAN WALTER HENRY
分类号 B05D5/12;H01C7/00;H01C17/065;H05K1/05 主分类号 B05D5/12
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