发明名称 |
Circuits including a titanium substrate |
摘要 |
A process is disclosed for manufacturing a thick-film circuit such as a hybrid circuit on a titanium or titanium-alloy substrate. The process includes firing a glassy dielectric layer upon at least one surface of the substrate. A thick-film circuit including a titanium or titanium-alloy substrate is also disclosed.
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申请公布号 |
US7632537(B2) |
申请公布日期 |
2009.12.15 |
申请号 |
US20030694888 |
申请日期 |
2003.10.29 |
申请人 |
HYBIRD ELECTRONICS AUSTRALIA PTY LTD. |
发明人 |
BERRYMAN WALTER HENRY |
分类号 |
B05D5/12;H01C7/00;H01C17/065;H05K1/05 |
主分类号 |
B05D5/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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