| 摘要 |
This invention provides an adhesive film for a semiconductor, comprising (A) an (meth)acrylic ester copolymer and (B) a thermoplastic resin different from the (meth)acrylic ester copolymer. The adhesive film for a semiconductor satisfies the following formula (1) in a period of 10 min to 2 hr from the start of measurement of the level of shear strain G caused upon the application of a shear stress of 3000 Pa at a frequency of 1 Hz and a temperature of 175°C using a parallel plate with a diameter of 20 mm. According to the present invention, even for a semiconductor device comprising semiconductor elements stacked in a multistage, in the step of filling a mold material, embeddability in substrate surface concavoconvexes can be improved even when the heat history in the step of wire bonding is long. 0.10 <= γ <= 0.30 (1). |
