| 摘要 |
A polyamide resin composition that simultaneously has mechanical properties, low warpage and weld strength being satisfactory for a resin composition for formation of a thin molding, such as a chassis or housing of electronic equipment. The glass fiber reinforced polyamide resin composition is one obtained by mixing 0.05 to 4.0 parts by mass of organic compound having at least two glycidyl groups or acid anhydride groups in each molecule with 100 parts by mass of polyamide resin composition consisting of a mixture of 30 to 80 mass% of polyamide resin of 1.5 to 4.0 relative viscosity as measured by means of Ubbelode viscometer using 96 mass% sulfuric acid as a solvent at 25°C and at a concentration of 1 g/dl and 20 to 70 mass% of flat glass fiber with a flat section of 1.5 to 10 major diameter/minor diameter ratio. Further, there is provided a resin molded item obtained by molding the above composition.
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