| 摘要 |
PROBLEM TO BE SOLVED: To inexpensively constitute a sliding-type peeling mechanism of a substrate to be processed, which securely peels the substrate to be processed without destroying it in substrate processing apparatus/method. SOLUTION: A vacuum chuck with heating mechanism, which adsorbs a supporting substrate, and one vacuum chuck in vacuum chucks adsorbing the substrate to be processed are connected to an arm-like supporting member operating in a horizontal direction by a member which expands and contracts. COPYRIGHT: (C)2010,JPO&INPIT |
