发明名称 MEASURING SYSTEM, MEASURING METHOD AND MEASURING PROGRAM FOR MOLD CLAMPING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a measuring system for a mold clamping apparatus can appropriately measure the posture and the like of a movable mold in a mold clamping apparatus. Ž<P>SOLUTION: The system includes the following means: a calculating means for calculating the coordinate values showing the relative position of the first marks against the second mark with respect to each of a plurality of images data obtained by imaging at the point of a mold clamping state and at the point of a movable mold moving process so as to include at least two first marks so added to the movable mold as to have a gap to the direction almost orthogonal to the mold opening-closing direction and a second mark added to the fixed member of the mold clamping apparatus stationary to the movement of the movable mold; a correction means for correcting the coordinate values of the first marks corresponding to the points in the moving process based on the coordinate values of those corresponding to the point in the mold clamping state; and an output means for outputting, based on the corrected coordinate values, the figure showing the posture of the movable mold in the moving process for it to be visible. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009285951(A) 申请公布日期 2009.12.10
申请号 JP20080139924 申请日期 2008.05.28
申请人 SUMITOMO HEAVY IND LTD 发明人 MORITA HIROSHI;KATO ATSUSHI
分类号 B29C45/80;B22D17/32;B29C33/22 主分类号 B29C45/80
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