| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate flattening device with a compact foot print, thinning and flattening a substrate by grinding and polishing its rear surface with high throughput. Ž<P>SOLUTION: This substrate flattening device 10 is provided with: a grinding stage 20 in which a substrate storage stage 13 is disposed outdoors and an articulated carrier robot 14, a temporary placing base 15 for positioning, a moving carrier pad 16, substrate holders 30a, 30b, 30c, 30d, 30e of a member constituting five stages of a substrate loading stage S1, a rough grinding stage S2, a semi-finishing grinding stage S3, a finishing grinding stage S4, and a substrate unloading stage S5 are disposed on a concentric circle on a first index rotating table 2 on a base 11 indoors; and a polishing stage 70 in which a substrate holder table 70a constituting a substrate loading/unloading/finishing polishing stage ps1, and a substrate holder table 70b constituting a rough polishing stage ps2, are disposed on a concentric circle on a second index rotating table 71. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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