发明名称 |
FABRICATION OF INORGANIC MATERIALS USING TEMPLATES WITH LABILE LINKAGE |
摘要 |
A method of forming an integrated circuit layer material is described, comprising depositing a layer of templates on a substrate, said template including a first binding site having an affinity for the substrate, a second binding site having an affinity for a target integrated circuit material and a protecting material coupled to the second binding site via a labile linkage to prevent the binding site from binding to the target integrated circuit material; exposing the template to an external stimulus to degrade the labile linkage; removing the protecting material; and binding the integrated circuit material to the second binding site.
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申请公布号 |
US2009305437(A1) |
申请公布日期 |
2009.12.10 |
申请号 |
US20070282160 |
申请日期 |
2007.03.08 |
申请人 |
CAMBRIOS TECHNOLOGIES CORPORATION |
发明人 |
ALLEMAND PIERRE-MARC;HEIDECKER MANFRED;KIRK GREGORY L.;QUAN XINA;WANG CHENG-I |
分类号 |
H01L21/36;C07K2/00;C07K16/00 |
主分类号 |
H01L21/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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