发明名称 ADHESION OF POLYAMIDES TO EPOXY RESINS
摘要 The adhesion of polyamide compositions to cured epoxy resins is im-proved when the composition contains relatively small amounts of novolac resins. Preferably the epoxy resin is cured in contact with a preformed poly-amide composition part, or the polyamide composition is molded while the polyamide is in contact with the cured or partially cured epoxy resin. Such assemblies are useful in electrical apparatus.
申请公布号 WO2009149143(A1) 申请公布日期 2009.12.10
申请号 WO2009US46064 申请日期 2009.06.03
申请人 E. I. DU PONT DE NEMOURS AND COMPANY;KANE, PAUL, J. 发明人 KANE, PAUL, J.
分类号 C08L77/06;B29C45/14;B29C65/70;B29C65/82;B32B27/34;B32B27/38;B32B27/42;C08J5/12;C08L63/02;C08L77/02;C09J5/10 主分类号 C08L77/06
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