发明名称 |
ADHESION OF POLYAMIDES TO EPOXY RESINS |
摘要 |
The adhesion of polyamide compositions to cured epoxy resins is im-proved when the composition contains relatively small amounts of novolac resins. Preferably the epoxy resin is cured in contact with a preformed poly-amide composition part, or the polyamide composition is molded while the polyamide is in contact with the cured or partially cured epoxy resin. Such assemblies are useful in electrical apparatus. |
申请公布号 |
WO2009149143(A1) |
申请公布日期 |
2009.12.10 |
申请号 |
WO2009US46064 |
申请日期 |
2009.06.03 |
申请人 |
E. I. DU PONT DE NEMOURS AND COMPANY;KANE, PAUL, J. |
发明人 |
KANE, PAUL, J. |
分类号 |
C08L77/06;B29C45/14;B29C65/70;B29C65/82;B32B27/34;B32B27/38;B32B27/42;C08J5/12;C08L63/02;C08L77/02;C09J5/10 |
主分类号 |
C08L77/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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