<p>A multilayer wiring board (100) has a first wiring region (101) wherein a wiring (103a) and insulating layers (104a, 104b) are alternately laminated; and a second wiring region (102) wherein a thickness (H2) of an insulating layer (104) is double a thickness (H1) of an insulating layer of the first wiring region (101) or more, and a width (W2) of a wiring (103b) is double a wiring width (W1) or more. The first wiring region (101) and the second wiring region (102) are integrally formed on the same substrate.</p>
申请公布号
WO2009147956(A1)
申请公布日期
2009.12.10
申请号
WO2009JP59422
申请日期
2009.05.22
申请人
NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY;FOUNDATION FOR ADVANCEMENT OF INTERNATIONAL SCIENCE;OHMI, TADAHIRO;SUGAWA, SHIGETOSHI;IMAI, HIROSHI;TERAMOTO, AKINOBU