| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive film for assuring sure electrical conduction even if filler and binder compositions are not sufficiently discharged from a space between a wiring board and a semiconductor chip when flip chip bonding of the semiconductor chip is carried out to the wiring board by using an adhesive film containing a non-conductive filler. <P>SOLUTION: The adhesive film for flip chip bonding of a semiconductor chip having bumps to a wiring board includes a binder composition containing an epoxy compound, a curing agent and a filler. The content of the filler to total amount of the epoxy compound, the curing agent and the filler is 10 to 70 mass%. The filler includes first non-conductive inorganic particles with an average particle size of 0.5 to 1.0μm, and conductive particles formed by treating second non-conductive inorganic particles with an average particle size of 0.5 to 1.0μm the average size of each particle is kept within 1.5μm by electroless deposition treatment, and 10 to 60 mass% of the filler are the conductive particles. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
