| 摘要 |
<P>PROBLEM TO BE SOLVED: To make a dicing blade not get clogged with copper in a method of manufacturing semiconductor devices in which the semiconductor devices having necessary semiconductor device formation areas 22a are obtained by cutting a semiconductor wafer having a plurality of necessary semiconductor device formation areas 22a and a plurality of unnecessary semiconductor device formation areas 22b differing in size, with the dicing blade along dicing streets 23 along four sides of the necessary semiconductor device formation areas 22a. Ž<P>SOLUTION: In an unnecessary semiconductor device formation area 22b, a columnar electrode 10 is formed of copper not in an area corresponding to a dicing street 23 and areas corresponding to both sides thereof, but only in an area excluding the area corresponding to the dicing street 23 and areas corresponding to both sides thereof. Consequently, the wafer is cut with the dicing blade along the dicing street 23, the columnar electrode 10 is not cut in the unnecessary semiconductor formation area 22b, so the dicing blade never gets clogged with copper. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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