| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cathode cartridge for electroplating, which does not damage a silicon wafer even if electrical insulators exert a large sandwiching force on the silicon wafer. Ž<P>SOLUTION: The cathode cartridge 1 for electroplating, which is used for sandwiching the silicon wafer W between a pair of the electrical insulators 2 and 3 and immersing the workpiece into a plating solution to form a plated film on a part exposed from an opening 4 of the electrical insulators on the silicon wafer W, is configured by forming a ring-shaped recess 5 on a mating face of the electrical insulator 3 so as to surround the opening 4 of the electrical insulator, accommodating and arranging a ring member 6 in the recess 5 in a state of making a sealing member 7 closely adjacent to the inner and outer circumferences of the ring member 6, and implanting a plurality of pin members 10 on the ring member 6 at an equal space in a circumferential direction. The pin member 10 includes: a housing which is inserted into bores 34 and 35 of the ring member 6; the body of the pin which is stored in the housing so as to be freely movable therein and projects its tip from the housing; and a spring which has been stored in the housing and energizes the body of the pin. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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