MULTILAYERED POLYIMIDE FILM

摘要

<P>PROBLEM TO BE SOLVED: To provide a heat-resistant adhesiveness multilayered film in which peeling during high temperature and high humidity does not occur. Ž<P>SOLUTION: The multilayered polyimide film includes at least a laminated structure of: a layer (a) mainly consisting of a fluorocarbon resin and a liquid crystal polymer of a thermotropic type; and a layer (b) of a non-thermoplasticity polyimide film consisting of a polyimide obtained by carrying out the polycondensation of an aromatic tetracarboxylic acids and aromatic diamines. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž