MICROSCOPIC STRUCTURE PACKAGING METHOD AND DEVICE WITH PACKAGED MICROSCOPIC STRUCTURE

摘要

The present invention discloses a method of packaging a microscopic structure (12). The method comprises the steps of forming the microscopic structure (12) on a substrate (10); depositing a layer (14) of a thermally decomposable polymer over the substrate, thereby embedding the microscopic structure; patterning the deposited layer (14) such that the microscopic structure is embedded in a portion of the patterned layer, the side walls of said portion (14) forming a substantially right angle with the substrate (10); growing a capping layer (18) over the portion, wherein the substantially right angles cause the formation of at least one channel (20) from the portion (14) through the capping layer (18); and decomposing the polymer, whereby the decomposition products escape from the portion (14) through said channel (20). The present invention further discloses a device including a microscopic structure packaged in accordance with the above method.