METHOD FOR MANUFACTURING PROBE DEVICE

摘要

Adjustment in a short period of time corresponding to specifications of a device to be tested is made possible in manufacture of a probe device which forms electrical connection to the device to be tested. A method for manufacturing a probe device includes: a via hole forming step of forming a via hole (330) which penetrates a testing substrate (301) from the front to the rear; a front surface side connecting pad forming step of forming a front surface side connecting pad (320) connected to a front surface side end portion of the via hole on the front surface of the testing substrate; and a rear surface side conductor pattern forming step of forming a rear surface side connecting pad (350) and a rear surface side wiring (340) which electrically connects the rear surface side end portion of the via hole and the rear surface side connecting pad, by jetting droplets of a conductive material toward the rear surface of the testing substrate and adhering the material thereon.