发明名称 |
WHITE HEAT-CURABLE SILICONE RESIN COMPOSITION AND OPTOELECTRONIC PART CASE |
摘要 |
A white heat-curable silicone resin composition comprising (A) a heat-curable organopolysiloxane, (B) a white pigment, (C) an inorganic filler, and (D) a condensation catalyst cures into a white uniform product having heat resistance, light resistance and minimal yellowing. The cured composition has a reflectance of at least 80% at wavelength 350-400 nm. The composition is useful for forming cases on optoelectronic parts, typically LED.
|
申请公布号 |
US2009304961(A1) |
申请公布日期 |
2009.12.10 |
申请号 |
US20090480118 |
申请日期 |
2009.06.08 |
申请人 |
TAGUCHI YUSUKE;SAWADA JUNICHI |
发明人 |
TAGUCHI YUSUKE;SAWADA JUNICHI |
分类号 |
C08K5/09;B32B1/02;C08K3/00;C08K3/22;C08K5/3492;C08K5/54;C08L79/04;C08L83/06;H01L33/48;H01L33/50;H01L33/60 |
主分类号 |
C08K5/09 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|