LED PACKAGE, AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an LED package capable of preventing discoloration of a mold portion to improve reliability of a package, and reducing the size of a light source, and to provide a method of manufacturing the same.

SOLUTION: Provided is an LED package including a heat radiating portion that is composed of two or more metal layers and has a cavity formed therein; a first lead that extends from one side of the heat radiating portion; a second lead that is formed in the other side of the heat radiating portion so as to be separated from the heat radiating portion; a mold portion that fixes the heat radiating portion and the first and second leads; an LED chip that is mounted in the cavity; and a first filler that is filled in the cavity so as to protect the LED chip, and the method of manufacturing the same.

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