| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a resin-sealed optical semiconductor device which can be miniaturized by reducing a clearance between a transparent member and the sidewall portion of a package, uses the upper surface of the transparent member as an optical reference surface, and does not easily let a sealing resin out. <P>SOLUTION: A chamfer 10C which forms an aperture which opens upward is formed on the upper portion of the inner side surface of sidewall portion 10B of a package 10. In addition, the surface roughness of the chamfer 10C is made to be rougher than the surface roughness of the inner side surface of the sidewall portion 10B of the package 10. <P>COPYRIGHT: (C)2010,JPO&INPIT |
