| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for simplifying the process of determining the model coefficient of a machined shape prediction model through an experiment and the like at the start of production, and automatically updating the prediction model coefficient during the production without any processes such as an experiment while regarding the prediction model coefficient as a variable. Ž<P>SOLUTION: In a system and method for manufacturing a semiconductor device by using a plasma processing apparatus, plasma processing conditions are controlled to have a desired shape after plasma processing by using: a machined shape prediction model for calculating, before processing, a shape after plasma processing based on test data of a wafer to be processed; and an application surface model for calculating a machined shape depending upon the plasma processing conditions. In this configuration, the machined shape prediction model has an adjustable prediction model coefficient which is automatically calibrated. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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