| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thin film adhesion strength evaluation method and an evaluation device capable of evaluating qualitatively and quantitatively thin film adhesion strength, which has been difficult to be evaluated by a conventional method. Ž<P>SOLUTION: This thin film adhesion strength evaluation method has processes for: applying ultrasonic vibration by allowing an ultrasonic vibration needle to abut on an edge part or its periphery in the face direction of the thin film formed on a substrate; detecting generation of exfoliation at the edge part of the thin film after application of the ultrasonic vibration; and evaluating thin film adhesion strength onto the substrate by a generation amount of exfoliation. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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