| 摘要 |
A semiconductor device includes a semiconductor chip, a wiring substrate, and wires. The semiconductor chip includes a first circuit, a second circuit having a function differing from that of the first circuit, a plurality of first pads disposed in a row along one side of the semiconductor chip and connected to the first circuit, and a plurality of second pads disposed between both of the first and second circuits and the first pads, and connected to the second circuit. The wiring substrate includes a plurality of terminals and the plurality of wires is connected between a plurality of terminals provided outside of the semiconductor chip, and ones of the first pads and the second pads. The wires are free from the other of the first pads and the second pads, and the plurality of the wires being not intersected to each other.
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