PYROPHOSPHATE-CONTAINING BATH FOR CYANIDE-FREE DEPOSITION OF COPPER-TIN ALLOYS
摘要
A pyrophosphate-containing bath for the cyanide-free deposition of copper alloys on substrate surfaces, comprising a reaction product of a secondary monoamine with a diglycidyl ether, is described. The electrolyte bath is suitable for the galvanic deposition of glossy white, even and uniform copper-tin alloy coatings.
申请公布号
WO2009146865(A1)
申请公布日期
2009.12.10
申请号
WO2009EP03886
申请日期
2009.05.29
申请人
ATOTECH DEUTSCHLAND GMBH;HARTMANN, PHILIP;SCHULZ, KLAUS-DIETER;KOHLMANN, LARS;BRUNNER, HEIKO