PROBE, ELECTRONIC COMPONENT TESTING DEVICE, AND PROBE MANUFACTURING METHOD

摘要

The probe (10) is provided with a membrane (20), which has a bump (22) that contacts an I/O terminal (110) of an IC device fabricated on a semiconductor wafer (100) to be tested, a pitch conversion substrate (40), in which a first terminal (41) is disposed on the bottom surface and a second terminal (42) connected to the first terminal (41) is disposed on the top surface, a printed circuit board (60), which is electrically connected to a test head (2) and has a third terminal (61), first anisotropic conductive rubber (30), which has a first conductor (31) that electrically connects the bump (22) on the membrane (20) and the first terminal (41) of the pitch conversion substrate (40), and second anisotropic conductive rubber (50), which has a second conductor (51) that electrically connects the second terminal (42) of the pitch conversion substrate (40) and the third terminal (61) of the printed circuit board (60). The second conductor (51) is disposed over the entirety of the second anisotropic conductive rubber (50).